QFP and QFN to DIP for Breadboarding

This product is an QFP and QFN to DIP adapter with a twist. These have our patented “ez“ technology which means that soldering the surface mount component is simple, and as with all of our “ez“ boards, we are the only company with a patented solution for easily soldering surface mount parts. This board supports both QFP and QFN packages. This board also includes room for 0805 SMT discrete components such as a bypass capacitor and pads for easy access to a ground. Additionally a large plated hole in the center of the device area, allows for the addition of solder to utilize ground pads on the bottom of the device.