xMEMS XMC-2400: The World’s First 1mm-Thin Active Micro Cooling Fan on a Chip

Thermal management is increasingly challenging, and passive heat spreaders are no longer sufficient on their own. xMEMS active µCooling, featuring an all-silicon, solid-state fan at the chip level, can effectively generate airflow and quickly dissipates heat, enabling active cooling smartphones, tablets and other thin mobile electronics.