Dave looks at some issues with fanning out tiny pitch BGA packages, via pad and hole size, tenting, breakouts, solder mask expansion etc.
And then compares it with an 1136 pin Xilinx Virtex 5 FPGA with 1mm pitch to show the difference in PCB process technologies needed.
FPGA Implementation Tutorial - EEVblog #193
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Теги: eevblog,video,pcb design,pcb layout,who to,tutorial,pcb manufacture,bga fanout,fpga fanout,fpga,bga package
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3 months ago 00:30:25 2
EEVblog #1322 - JBL LSR308 Studio Monitor Speaker REPAIR