Intel Accelerated: Introducing New RibbonFET and PowerVia Technologies

▶ Learn more about Intel’s Process and Packaging Innovations: At its “Intel Accelerated“ event on July 26, 2021, Intel introduced #RibbonFET, its first new transistor architecture in more than a decade, and #PowerVia, an industry-first new backside power delivery method. RibbonFET, Intel’s implementation of a gate-all-around transistor, will be the company’s first new transistor architecture since it pioneered FinFET. The #technology delivers faster transistor switching speeds while achieving the same drive current as multiple fins in a smaller footprint. PowerVia is Intel’s unique industry-first implementation of backside power delivery, optimizing signal transmission by eliminating the need for power routing on the front side of the wafer. #Intel ▶ Learn more from #IntelAccelerated: About Intel Newsroom Intel Newsroom brings you the latest news and updates on world-changing technology that enriches the lives of everyone on Earth. Connect with us today! Subscribe now to Intel Newsroom on YouTube: Visit the Intel Newsroom: Follow @IntelNews on Twitter: