The Pin Fin heat sink for IGBT made by “ Forging”

The Pin Fin heat sink for IGBT made by “ Forging”, which makes it possible to achieve significantly cooling performance against other manufacturing process, with some obvious advantages as following. *Complete in one piece by cold forging with no interface *Material: Al1050/1070 or Al6063, C1100, Cu/Al bonded Material *High material density increases thermal conductivity *Round pins improves airflow smooth through (Round, Ellipse,Square fins are available) *High aspect ratio 1:50 *Better cooling performance, *Wide range of geometry *Weight reduction. *High quality and very competitive price More information, pls visit If any inquiry, welcome to contact us info@